Techstar Innovations

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Techstar Innovations
Category: Unknown

Key contact details for Techstar Innovations
Phone
6899 0010
Email
Email business
Website
www.techstar-i.com
Address
25 pandan crescent 06-15, tic tech centre,, 128477
 

Solder Ball

Inspection System

Wire Bonding


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Business profile

A specialist in semiconductor Gold Wire Bonder, Die Bonder, Flip Chip Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, Aluminium Wire Wedge Bonder, Auto Molding System and Leadframe Inspection System

  • Business profile

    A specialist in semiconductor Gold Wire Bonder, Die Bonder, Flip Chip Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, Aluminium Wire Wedge Bonder, Auto Molding System and Leadframe Inspection System

Techstar Innovations's Keywords

Solder Ball | Inspection System | Wire Bonding | Aluminium Wire | Die Bonder | Solder Sphere | Aluminium Wire Bonder | Flip Chip Bonder | Aluminium Wire Wedge Bonder | Aluminium Wedge Bonder | Semiconductor Wire Bonders | Ultra Fine Pitch Wire Bonders | Sphere Ball | Gold Wire Bonder | Lead Frame Inspection